MediaTek has unveiled a new member of the Dimensity 8000 series that will power sub-flagship phones of next year. Meet the new MediaTek Dimensity 8300, which was built using TSMC’s 2nd generation 4nm process.
The MediaTek Dimensity 8300 consists of four Cortex-A715 performance cores clocked at 3.35GHz and four Cortex-A510 efficiency cores of up to 2.2GHz. The entire CPU is based on the Armv9, which the company claims can offer up to 20% faster CPU performance and 30% power efficiency than its predecessor, the Dimensity 8200.
On the GPU side, we have the Arm Mali-G615 MC6 GPU that provides 60% performance improvement and 55% better power efficiency than its predecessor.
MediaTek also said that the new chipset is up to 17% faster in terms of app cold launch and 47% faster in app launch from standby. The new chip can accommodate quad-channel LPDDR5X RAM with 8533Mbps speeds and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.
One big inclusion is the APU 780, making it the first chip in its class to have Generative AI, with stable diffusion and LLM support with up to 10 billion parameters,
For imaging, it has the Imagiq 980 ISP that can accommodate up to 320-megapixel sensors and 4K@60fps video recording.
As for connectivity, it has the latest Bluetooth 5.4 standard, WiFi 6E, and has an integrated 5G modem to enable dual-mode 5G with up to 5.17Gbps download speeds under sub-6GHz. The devices rocking this new chipset shall be announced soon.
